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Failure Analysis

PALCO’s Failure Analysis Labs are state-of-the-art. Our experts thoroughly and accurately perform root-cause failure analysis by collecting and analyzing data utilizing a wide array of technologies and methodologies. PALCO performs both non-destructive and destructive analysis. Utilizing a third party for failure analysis establishes logical checks and balances in both business and engineering disciplines.

Sample of Supporting Hardware:

  • HASS / HALTORT - Thermal Chambers
  • BGA Rework Stations
  • 2D X-Ray Inspection
  • 3D X-Ray Inspection
  • Thermal Imaging
  • Bus Analyzers
  • Stereo Microscopes
  • Logic Analyzers
  • High Speed O'scopes
  • Spectrum Analyzer
  • Electro-Microscope

Sample of Supporting Methodologies:

  • Failure Mode and Effect Analysis
  • Fault Tree Analysis
  • Mean Time Between Failure Analysis
  • Precision Micro-Sectioning
  • De-Cap

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